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Soldering & Surface Mount Technology seeks to make an important contribution to the advancement of research and application within the technical body of knowledge and expertise in this vital area. Soldering & Surface Mount Technology compliments its sister publications; Circuit World and Microelectronics International.
The journal covers all aspects of SMT from alloys, pastes and fluxes, to reliability and environmental effects, and is currently providing an important dissemination route for new knowledge on lead-free solders and processes. The journal comprises a multidisciplinary study of the key materials and technologies used to assemble state of the art functional electronic devices. The key focus is on assembling devices and interconnecting components via soldering, whilst also embracing a broad range of related approaches.
《Soldering & Surface Mount Technology》是一本由Emerald Group Publishing Ltd.出版商出版的專業工程技術期刊，該刊創刊于1981年，刊期Quarterly，該刊已被國際權威數據庫SCIE收錄。在中科院最新升級版分區表中，該刊分區信息為大類學科：工程技術 4區，小類學科：冶金工程 2區；工程：電子與電氣 3區；工程：制造 3區；材料科學：綜合 3區；在JCR（Journal Citation Reports）分區等級為Q3。該刊發文范圍涵蓋工程：電子與電氣等領域，旨在及時、準確、全面地報道國內外工程：電子與電氣工作者在該領域取得的最新研究成果、工作進展及學術動態、技術革新等，促進學術交流，鼓勵學術創新。2021年影響因子為1.494，平均審稿速度>12周，或約稿。
| 大類學科 | 分區 | 小類學科 | 分區 | Top期刊 | 綜述期刊 |
| 材料科學 | 3區 | ENGINEERING, ELECTRICAL & ELECTRONIC 工程：電子與電氣 MATERIALS SCIENCE, MULTIDISCIPLINARY 材料科學：綜合 METALLURGY & METALLURGICAL ENGINEERING 冶金工程 ENGINEERING, MANUFACTURING 工程：制造 | 3區 3區 3區 4區 | 否 | 否 |
| JCR分區等級 | JCR所屬學科 | 分區 | 影響因子 |
| Q3 | METALLURGY & METALLURGICAL ENGINEERING | Q3 | 1.494 |
| MATERIALS SCIENCE, MULTIDISCIPLINARY | Q4 | ||
| ENGINEERING, ELECTRICAL & ELECTRONIC | Q4 | ||
| ENGINEERING, MANUFACTURING | Q4 |
| 影響因子 | h-index | Gold OA文章占比 | 研究類文章占比 | OA開放訪問 | 平均審稿速度 |
| 1.494 | 28 | 0.89% | 100.00% | 未開放 | >12周，或約稿 |
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